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Offers wafer grinding, dicing, polishing and flip chip service to transfer wafer dice to tape and reel.
Silicon Valley based wafer foundry offering 4", 5", 6", 8", and 12" wafers for 100-300mm. Also offers wafer reclamation and recycling services and products.
Offers thinning silicon, GaAs, InP, InSb, GaSb, GaP or any other semiconductor or insulating material wafers or dice. East and West coast, USA, facilities.
Specializing in semiconductor wafer precision grinding. Chandler, AZ, USA.
Manufactures small diameter silicon wafers for reclaim, test, prime, and double-side polish specifications in research and production quantities. Wafer specifications, pricing, and online order form.
Provides silicon, sapphire, GaAs, silicon carbide, germanium, and other material wafers to companies and universities. List of materials and current stock.
Compound semiconductor foundry service provider for wireless telecommunication, high-speed networking, opto-electronics and automotive industries, located in Torrance, CA, USA.
Manufactures products for various applications covering a variety of computer, communications and consumer electronics market segments.
Provides 4", 5" and 6" prime polished silicon wafers. Has manufacturing plants in Shanghai, PRC, and California, U.S.A., in addition to the headquarters and factory in Yang-Mei, Taiwan.